application engineers maekawa keisuke and the company's marketing vice president of gle-yvelaine. reporter: ux: 3 in the led chip embedded n-type contact electrode, through the through hole and the n-type gan semiconductor layer electrical connections. why using this electrode configuration or structure, can be reduced auger recombination? osram: auger recombination in the led active layer flows through the higher current density the more significant. ux: 3 structure has the effect of current density can be reduced, thereby reducing auger recombination. previously, the blue led chip is the "thingardquo; technology is in the chip set n-type contact electrode surface. specifically, it is the four-terminal end of the chip set for the electrical connections from the outside pad, and to connect the pad electrode line (grid) around the chip surface, thereby making current flow through the whole chip. in fact the current class is not all over the chip surface of the chip.
menu boardthe team will be the incoming signal by the spectrum block, its parallel processing, and eventually to form a whole. high-frequency pulse can be given time "packages" for more information. if you want to capture complex waveforms and its fast decoding for the digital electronic signal, the device needs to "bundling" more data and converted to optical signals. instead, the device needs to obtain electronic signals from a light signal. this technology can be used for ultra high-speed communication systems and light detection and ranging system (lidar) in. lidar can quickly scan through the landscape of the laser pulse, and generates very detailed three-dimensional images of the earth surface. the researchers said further research will be dedicated to all the equipment the team implanted a tiny silicon chip, so its better to work with the application.
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